FormFactor Introduces Rapid Cooling Probe System for Quantum Device Testing
Traditional cryogenic chip probing methodologies can require 24 hours or more to exchange and cool the devices from room temperature to 4 Kelvin. To eliminate more than 90% of this unproductive overhead, the IQ2000 innovative load-lock chamber and cryogenic probe head provide tool-free device exchange without warming up or opening the ultra-cold test environment. To further accelerate test, a high density electrical probe interface is also available to enable high-bandwidth, parallel device contact.
The IQ2000’s key features include:
- Faster time to data with a load-lock chamber to cycle devices up to ten times faster in a cryogenic environment
- Options for <2K or <4K base temperature, with high cooling power (>200mW @ 4K)
- Up to 128 low-frequency signals and up to 28 high-bandwidth (>12.5 GHz) for parallel device test with FormFactor’s leading probe card technologies
- Low vibration system for stable device contact and low-noise measurements
“Quantum test engineers have long struggled with limited throughput due to the time it takes to cool down each device,” said
To learn more about FormFactor’s new rapid cooling probe system and other cryogenic products, visit https://www.formfactor.com/products/quantum-cryo.
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Source: FormFactor, Inc.