FormFactor Presents New Wafer Probe Test Technologies at SWTest Asia
This year at SWTest Asia, the company will present three technical papers highlighting new wafer probe technologies:
FormFactorwill present the advantages of its new Altius™ vertical MEMS wafer probe technology designed to address the challenges of fine pitch (sub-50 µm) microbump probing for both 2.5/3D interposers and High Bandwidth Memory die used in advanced packaging applications. FormFactor’s CMO Amy Leong will address these challenges and discuss FormFactor’s technology solutions using Altius and other FormFactorwafer probe technologies in a presentation entitled “Advanced Packaging - It's Changing the World of Wafer Test” on Thursday, October 17th.
- Targeting the test challenges of wide temperature range, high-parallelism testing in automotive applications,
FormFactorintroduces its DragonBlade™ MEMS contact technology capable of low-impact full 300mm wafer probing at temperatures ranging from -40 to +175°C. FormFactor’s Alan Liaoand Hirofumi Nagatawill present the paper “Ultra High Temperature Production Probe Card Solution” on Friday, October 18th.
Takao Saekiwill unveil Takumi CL, a new low-impact parametric MEMS probe card for low-leakage and small pad size applications. Featuring a new 2D MEMS spring and contact tip, the Takumi CL offers a consistent small scrub mark over the life of the product, with the benefits of low cost and fast manufacturing lead time. The paper, “Takumi CL – New 2D-MEMS Spring Introduction to FormFactor Parametric Probe Card and Comparison with 3D MEMS Spring,” will be presented on Friday, October 18th.
“SWTest Asia brings together the global test experts working on groundbreaking innovations in semiconductor test,” said
David VieraCorporate Communications (925) 290-4182 email@example.com Investor Contact Stan FinkelsteinInvestor Relations (925) 290-4321 firstname.lastname@example.org
Source: FormFactor, Inc.