FormFactor Introduces the Altius™ Vertical MEMS Probe Card for Advanced Packaging Technologies
Adoption of advanced packaging is accelerating as the benefit of the classic Moore’s Law transistor shrink diminishes. Advanced packages enable the heterogenous integration of multiple different die through high-density interconnects, for improved device performance and smaller footprint. Advanced packaging architectures are augmenting Moore’s Law to meet the demands for greater connectivity, computing power, speed, and cost-effectiveness in applications such as 5G, IoT, and artificial intelligence. According to Yole Développement, the overall advanced packaging market will grow at an 8% CAGR, reaching almost
“Advanced packaging and heterogenous integration raise the bar for wafer test; increasing both complexity and coverage. The contact pattern for wafer probe is generally two to four times denser than a monolithic die and higher quality test is required to ensure a bad chip does not ‘kill’ several otherwise good chips in the same advanced package,” said
The Altius probe card’s core capabilities include:
- Minimum grid-array pitch of 45 µm
- Ultra-low probe force for direct probing on copper through silicon vias or solder microbumps, ~1 gram per probe at operating overtravel with best-in-class contact resistance stability
- Support for HBM known-good-die or known-good-stack test, >=3 Gbps test speed
- Scalable for multi-site test to increase throughput, X4 capable for HBM
- Configurable with Hybrid MEMS probes for mixed-pitch microbump layout
To request more information about Altius, visit www.formfactor.com/contact-sales.
*Source: Status of the Advanced Packaging Industry, 2019 Report, Yole Développement, 2019.
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Source: FormFactor, Inc.